IPC/WHMA-A-620B-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B
53 Products
IPC/WHMA-A-620B-AM1: Requirements and Acceptance for Cable and Wire Harness Assemblies
IPC-A-610E-RL: Acceptability of Electronic Assemblies
IPC-A600H-Errata: IPC-A-600H Errata Information
IPC-J-STD-001E-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline
IPC-J-STD-001ES: Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic...
7351B-DE: Basisanforderungen an das SMT-Design und SMD-Anschlussflächen-Richtlinie
IPC-1601-DE: Handhabung und Lagerung von Leiterplatten
IPC-6012DS-DE: Ergänzung zu IPC-6012D-DE Qualifikation und Leistungsspezifikation für starre Leiterplatten für Raumfahrt-Anwendungen
IPC-6012D-DE: Qualifikation und Leistungsspezifikation für starre Leiterplatten
IPC-A-610E-DE: Abnahmekriterien für elektronische Baugruppen
QF-143: Specifications for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards
IPC-SG-141: Specification for Finished Fabric Woven from "S" Glass for Printed Boards
IPC-DR-570A: General Specification for 1/8 inch Diameter Shank Carbide Drills for Printed Boards
IPC-D-350D: Printed Board Description in Digital Form
IPC-CI-408: Design & Application Guidelines for the Use of Solderless Surface Mount Connectors
IPC-5704: Cleanliness Requirements for Unpopulated Printed Boards
IPC-6015: Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting & Interconnecting Structures
IPC-4130: Specification & Characterization Methods for Nonwoven "E" Glass Mat
IPC-4121: Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications
IPC-4110: Specification & Characterization Methods for Non Woven Cellulose Based Paper for Printed Boards
IPC-2615: Printed Board Dimensions and Tolerances
IPC-2225: Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies
IPC-A-610E: Acceptability of Electronic Assemblies