49 Products

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IPC/WHMA-A-620B-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B

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IPC/WHMA-A-620B-AM1: Requirements and Acceptance for Cable and Wire Harness Assemblies

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IPC-A-610E-RL: Acceptability of Electronic Assemblies

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IPC-A600H-Errata: IPC-A-600H Errata Information

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IPC-J-STD-001E-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline

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IPC-J-STD-001ES: Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic...

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IPC-4103B: Specification for Base Materials for High Speed/High Frequency Applications

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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English [DRM...

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IPC-J-STD-001G-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline - English

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IPC-A-610G-RL: Acceptability of Electronic Assemblies-Redline

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IPC-J-STD-003C-WAM1&2: Solderability Tests for Printed Boards - English

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IPC-A-610G: Acceptability of Electronic Assemblies

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J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-7091: Design and Assembly Process Implementation of 3D Components

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IPC-4552A: Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards

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IPC-7711/21C REDLINE: Rework, Modification and Repair of Electronic Assemblies - Redline

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IPC-S-816: SMT Process Guideline Checklist

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IPC-OI-645: Standard for Visual Optical Inspection Aids

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IPC/JEDEC-J-STD-035: Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components

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IPC-5704: Cleanliness Requirements for Unpopulated Printed Boards

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IPC-9502: PWB Assembly Soldering Process Guideline for Electronic Components

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IPC-9191: General Guidelines for Implementation of Statistical Process Control (SPC)

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IPC-A-610E: Acceptability of Electronic Assemblies

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J-STD-001E: Requirements for Soldered Electrical and Electronic Assemblies