IPC-7530: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes
5 Products
Member: $47.00 Nonmember: $93.00
Member: $47.00 Nonmember: $93.00
IPC-6015: Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting & Interconnecting Structures
Member: $47.00 Nonmember: $93.00
IPC-4130: Specification & Characterization Methods for Nonwoven "E" Glass Mat
Member: $47.00 Nonmember: $93.00
IPC-4110: Specification & Characterization Methods for Non Woven Cellulose Based Paper for Printed Boards
Member: $66.00 Nonmember: $131.00
IPC-2225: Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies