IPC/WHMA-A-620B-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B

IPC/WHMA-A-620B-AM1: Requirements and Acceptance for Cable and Wire Harness Assemblies

IPC-4103B: Specification for Base Materials for High Speed/High Frequency Applications

EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English [DRM...

IPC-J-STD-001G-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline - English

IPC-A-610G-RL: Acceptability of Electronic Assemblies-Redline

IPC-J-STD-003C-WAM1&2: Solderability Tests for Printed Boards - English

IPC-A-610G: Acceptability of Electronic Assemblies

J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies

IPC-7091: Design and Assembly Process Implementation of 3D Components

IPC-4552A: Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards

IPC-7711/21C REDLINE: Rework, Modification and Repair of Electronic Assemblies - Redline

IPC-J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations

D-356B: Bare Substrate Electrical Test Data Format

IPC-DR-572A: Drilling Guidelines for Printed Boards

IPC-2316: Design Guide for Embedded Passive Device Printed Boards

IPC-9199: Statistical Process Control (SPC) Quality Rating

IPC-8413-1: Specification for Process Carriers Used to Handle Optical Fibers in Manufacturing

IPC-6015: Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting & Interconnecting Structures

IPC-5701: Users Guide for Cleanliness of Unpopulated Printed Boards

IPC-4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement

IPC-4130: Specification & Characterization Methods for Nonwoven "E" Glass Mat

IPC-4110: Specification & Characterization Methods for Non Woven Cellulose Based Paper for Printed Boards

IPC-2252: Design Guide for RF/Microwave Circuit Boards