IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium
IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...
IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies
IPC-7711/21B-SW: Rework, Modification and Repair of Electronic Assemblies
A-600GPL(D)1: Acceptability of Printed Boards
IPC/WHMA-A-620A-PL: Rev A superseded by Rev B
J-STD-004B-CN: 修订本 1 助焊剂要求
J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...
J-STD-075-DE: Classification of Non-IC Electronic Components for Assembly Processes
IPC-6015: Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting & Interconnecting Structures
IPC-4130: Specification & Characterization Methods for Nonwoven "E" Glass Mat
IPC-4110: Specification & Characterization Methods for Non Woven Cellulose Based Paper for Printed Boards
IPC-2225: Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies
IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability
IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components
IPC-6017: Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices