27 Products

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IPC-J-STD-001GA/A-610GA: Automotive Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610G...

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IPC-J-STD-001GS-AM1: Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001G. Requirements for Soldered Electrical...

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IPC-6012E: Qualification and Performance Specification for Rigid Printed Boards

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IPC-1791A: Trusted Electronic Designer, Fabricator and Assembler Requirements

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IPC-7351B: 表面贴装设计及连接盘图形标准通用要求

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IPC-2223E: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

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IPC/WHMA-A-620D: Requirements and Acceptance for Cable and Wire Harness Assemblies

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IPC-A-610E-RL: Acceptability of Electronic Assemblies

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IPC-A600H-Errata: IPC-A-600H Errata Information

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IPC-J-STD-001E-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline

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IPC-J-STD-001ES: Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic...

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IPC-A-610E-NL: Acceptatie van Geassembleerde Printplaten

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IPC-SM-840E-CN: 永久性阻焊剂和挠性覆盖材料的鉴定和性能规范

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IPC/JEDEC-J-STD-020D-1-CN: IPC/JEDEC 非气密固态表面贴装器件潮湿/再流焊敏感度分级

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IPC-A-610E-CN: 电子组件的可接受性

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J-STD-001E-CN: Rev E superseded by Rev F

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IPC-1601-CN: 印制板操作和贮存指南

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IPC-5704: Cleanliness Requirements for Unpopulated Printed Boards

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IPC-6015: Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting & Interconnecting Structures

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IPC-4130: Specification & Characterization Methods for Nonwoven "E" Glass Mat

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IPC-4110: Specification & Characterization Methods for Non Woven Cellulose Based Paper for Printed Boards

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IPC-2225: Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies

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IPC-A-610E: Acceptability of Electronic Assemblies

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J-STD-001E: Requirements for Soldered Electrical and Electronic Assemblies