IPC-4556: 印制板化学镍/钯/浸金（ENEPIG）规范

IPC/WHMA-A-620B-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B

IPC/WHMA-A-620B-AM1: Requirements and Acceptance for Cable and Wire Harness Assemblies

IPC-7095C-CN: BGA设计与组装工艺的实施

IPC-A-600G-CH: Acceptability of Printed Boards

IPC-A-630-CN: 电子产品整机的制造、检验和测试的可接受性标准

J-STD-006C-CN: 电子焊接领域电子级焊料合金及含助焊剂与不含助焊剂的固体焊料的要求

IPC/JEDEC-J-STD-035: Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components

D-356B: Bare Substrate Electrical Test Data Format

IPC-9502: PWB Assembly Soldering Process Guideline for Electronic Components

IPC-9199: Statistical Process Control (SPC) Quality Rating

IPC-9191: General Guidelines for Implementation of Statistical Process Control (SPC)

IPC-4121: Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications

IPC-2615: Printed Board Dimensions and Tolerances

IPC-2252: Design Guide for RF/Microwave Circuit Boards

IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards

IPC-HDBK-830A: Guidelines for Design, Selection, and Application of Conformal Coatings

IPC-A-630: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-9641: High Temperature Printed Board Flatness Guideline

J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...

IPC-2291: Design Guideline for Printed Electronics

IPC-T-50K: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC/JEDEC/ECA-J-STD-002D: EIA/IPC/JEDEC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-5703: Cleanliness Guidelines for Printed Board Fabricators