IPC-HDBK-830A: Guidelines for Design, Selection, and Application of Conformal Coatings

IPC-A-630: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...

IPC/WHMA-A-620B-AM1: Requirements and Acceptance for Cable and Wire Harness Assemblies

IPC-2291: Design Guideline for Printed Electronics

IPC-T-50K: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-9641: High Temperature Printed Board Flatness Guideline

IPC/JEDEC/ECA-J-STD-002D: EIA/IPC/JEDEC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards

IPC/WHMA-A-620B-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B

IPC-5703: Cleanliness Guidelines for Printed Board Fabricators

IPC-7095C: Design and Assembly Process Implementation for BGAs

IPC-4203A: Cover and Bonding Material for Flexible Printed Circuitry

IPC-9592B: Requirements for Power Conversion Devices for the Computer and Telecommunications Industries

IPC-9850A: Surface Mount Placement Equipment Characterization

IPC-J-STD-004B-AM1: Requirements for Soldering Fluxes

IPC-7525B-DE: Designrichtlinie für Druckschablonen

IPC-7525B: Stencil Design Guidelines

IPC-9202: Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance

IPC-T-50J: SUPERSEDED BY T-50K

IPC-9709: Test Guidelines for Acoustic Emission Measurement during Mechanical Testing

IPC/JEDEC-9707: Spherical Bend Test Method for Characterization of Board Level Interconnects

IPC-CH-65B: Guidelines for Cleaning of Printed Boards and Assemblies

IPC-7093: Design and Assembly Process Implementation for Bottom Termination Components