IPC-9204: 印刷电子柔性与可拉伸性能测试指南

IPC-7530A: 群焊工艺温度曲线指南（再流焊和波峰焊

IPC-A-640: 光纤，光缆和混合线束组件的验收要求

IPC-4921A: 印刷电子基材（基板）要求

IPC-6903A: 印刷电子设计与生产的术语及定义

IPC-J-STD-002E: 元器件引线、焊端、焊片、端子和导线的可焊性测试

IPC-4556: 印制板化学镍/钯/浸金（ENEPIG）规范

IPC-4101E: 刚性及多层印制板用基材规范

IPC/WHMA-A-620B-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B

IPC/WHMA-A-620B-AM1: Requirements and Acceptance for Cable and Wire Harness Assemblies

IPC-J-STD-001G: 焊接的电⽓和电⼦组件要求

IPC-A-610G: 电⼦组件的可接受性 - Chinese

IPC-4103B: Specification for Base Materials for High Speed/High Frequency Applications

EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English [DRM...

IPC-J-STD-001G-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline - English

IPC-A-610G-RL: Acceptability of Electronic Assemblies-Redline

IPC/WHMA-A-620C:线缆及线束组件的要求与验收 - Chinese

IPC-J-STD-003C-WAM1&2: Solderability Tests for Printed Boards - English

IPC-A-610G: Acceptability of Electronic Assemblies

J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies

IPC-7091: Design and Assembly Process Implementation of 3D Components

IPC-4552A: Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards

IPC-7711/21C REDLINE: Rework, Modification and Repair of Electronic Assemblies - Redline

IPC-1072AM1: Intellectual Property Protection in Electronic Assembly Manufacturing