IPC-HERMES-9852: 表面贴装技术组装中机器对机器通信的全球标准

IPC-9121-AM2: Troubleshooting for Printed Board Fabrication Processes, Amendment 2

IPC-8921: Requirements for Woven and Knitted Electronic Textiles (E-Textiles) Integrated with Conductive Fibers, Conductive Yarns...

IPC-9111: 印制电路板组装工艺的故障排除

IPC-2591: 互联工厂数据交换（CFX）

IPC-7095D-WAM1: Design and Assembly Process Implementation for BGAs, with Amendment 1

IPC-HERMES-9852: The Global Standard for Machine-to-Machine Communication in SMT Assembly

IPC-2231: DFX Guidelines

IPC-1754-WAM1: Materials and Substances Declaration for Aerospace and Defense and Other Industries

IPC-1791-Amendment 1: Trusted Electronic Designer, Fabricator and Assembler Requirements, Amendment 1

IPC-2591: Connected Factory Exchange (CFX)

IPC-9111:Troubleshooting for Printed Board Assembly Processes

IPC-CC-830C: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

IPC-4556: 印制板化学镍/钯/浸金（ENEPIG）规范

IPC/WHMA-A-620B-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B

IPC/WHMA-A-620B-AM1: Requirements and Acceptance for Cable and Wire Harness Assemblies

IPC-J-STD-004B-AM1: Requirements for Soldering Fluxes

IPC-7095C-CN: BGA设计与组装工艺的实施

IPC-A-600G-CH: Acceptability of Printed Boards

IPC-A-630-CN: 电子产品整机的制造、检验和测试的可接受性标准

IPC-CH-65B-CN: 印制板及组件清洗指南

IPC-7093-CN: 底部端子元器件(BTC)设计和组装工艺的实施

IPC-7525B-CN: 模板设计指导

J-STD-006C-CN: 电子焊接领域电子级焊料合金及含助焊剂与不含助焊剂的固体焊料的要求