IPC-A-610F AM1-CN: 电子组件的可接受性 修订本1
IPC-1072: Intellectual Property Protection in Electronic Assembly Manufacturing
IPC-HDBK-4691: Handbook on Adhesive Bonding in Electronic Assembly Operations
IPC-4103 WAM1 - AM2: Amendment 2 to Specification for Base Materials for High Speed/High Frequency...
J-STD-001F AM1: Requirements for Soldered Electrical and Electronic Assemblies - Amendment 1
IPC-6903: Terms and Definitions for the Design and Manufacture of Printed Electronics (Additive Circuitry)
IPC-6012D-Redline: Qualification and Performance Specification for Rigid Printed Boards-Red Line
IPC-6012DS: Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid...
IPC-6012D: Qualification and Performance Specification for Rigid Printed Boards
IPC/JPCA-6901: Application Categories for Printed Electronics
IPC-T-50M: Terms and Definitions for Interconnecting and Packaging Electronic Circuits
IPC-7801: Reflow Oven Process Control Standard
IPC-7801: 再流焊炉工艺控制标准 - Chinese
IPC-7092: Design and Assembly Process Implementation for Embedded Components
IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
IPC-HDBK-830A: Guidelines for Design, Selection, and Application of Conformal Coatings
IPC-A-630: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures
J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...