77 Products

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IPC-1401: Supply Chain Social Responsibility Management System Guidance

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IPC-4101E: Specification for Base Materials for Rigid and Multilayer Printed Boards

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IPC-9204: 印刷电子柔性与可拉伸性能测试指南

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IPC-9204: Guideline on Flexibility and Stretchability Testing for Printed Electronics

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IPC-A-610FC: Telecom Addendum to IPC-A-610 Revision F Acceptability of Electronic Assemblies

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IPC-7711/21C: Rework, Modification and Repair of Electronic Assemblies

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J-STD-001FS WAM 1: Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical...

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IPC/WHMA-A-620C: IPC/WHMA-A-620C Requirements and Acceptance for Cable and Wire Harness Assemblies

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IPC/WHMA-A-620C:线缆及线束组件的要求与验收 - Chinese

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IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives

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IPC-FC-234A: Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards

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J-STD-001F: J-STD-001 Revision E to Revision F Redline Comparison Document

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IPC-A-610F: IPC-A-610 Revision E to Revision F Redline Comparison Document

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IPC-SM-817A-CN: 表面贴装用绝缘粘合剂通用规范

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IPC-A-610F: Acceptability of Electronic Assemblies

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J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies

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J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

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IPC-HDBK-630: Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures

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IPC-8701: Final Acceptance Criteria Standard for PV Modules-Final Module Assembly

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IPC-4101D-WAM1: Specification for Base Materials for Rigid and Multilayer Printed Boards

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J-STD-003C-CN-WAM1: 印制板可焊性测试

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IPC-J-STD-003C: Solderability Tests for Printed Boards Amendment 1

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IPC-4103A WAM1: Specification for Base Materials for High Speed/High Frequency Applications

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J-STD-030A: Selection and Application of Board Level Underfill Materials