111 Products

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IPC-A-610E-FR: Acceptabilité des assemblages électroniques

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IPC-2221B-FR: Norme Générique de Conception du Circuit imprimé

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IPC-2222A-FR: Norme Sectionnelle de Conception pour les Circuits Imprimés Organiques Rigides

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IPC/WHMA-A-620B-FR: Exigences et critères d'acceptabilité pour l'interconnexion des faisceaux de fils et de câbles

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J-STD-001E-FR: Exigences des Assemblages Electriques et Electroniques Brasés

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A-620A-FR: Exigences et critères d’acceptation pour l’assemblage des câbles et faisceaux de câbles

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IPC-A-610E-IT: Accettabilità degli Assemblaggi Elettronici

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7351B-DE: Basisanforderungen an das SMT-Design und SMD-Anschlussflächen-Richtlinie

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IPC-1601-DE: Handhabung und Lagerung von Leiterplatten

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J-STD-001D-DE: Requirements for Soldered Electrical and Electronic Assemblies

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IPC/JEDEC-J-STD-020D-DE: IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

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7351A-DE: SUPERSEDED BY 7351B-DE

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IPC/WHMA-A-620A-DE: Rev A superseded by Rev B

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IPC-6012D-DE: Qualifikation und Leistungsspezifikation für starre Leiterplatten

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IPC-2221B-DE: Basisrichtlinie für das Design von Leiterplatten

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IPC/WHMA-A-620B-DE: Anforderungen und Abnahmekriterien für Kabel- und Kabelbaum-Baugruppen

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IPC/JEDEC-J-STD-033C-DE: Handhabung, Verpackung, Transport und Einsatz feuchtigkeits-/reflow- und/oder prozessempfindlicher Bauteile

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IPC-A-610E-DE: Abnahmekriterien für elektronische Baugruppen

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IPC-CC-830B WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...

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IPC-5704: Cleanliness Requirements for Unpopulated Printed Boards

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IPC-A-610E: Acceptability of Electronic Assemblies

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J-STD-001E: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-SM-840E: Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials

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IPC-9631: User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation