22 Products

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IPC/WHMA-A-620B-Redline

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A-620B-TR: Kablo ve Kablo Takımları için Kabul Gereklilikleri

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A-620B-HU: IPC/WHMA-A-620B 1. módosításokat tartalmazó változat

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IPC/WHMA-A-620B: Superseded by IPC/WHMA-A-620C: IPC/WHMA-A-620B Requirements and Acceptance for Cable and Wire Harness Assemblies

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IPC/JPCA-4921: Requirements for Printed Electronics Base Materials (Substrates)

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IPC/WHMA-A-620AS-AM1: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A

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IPC/JEDEC J-STD-609A Errata Information

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IPC-7527: Requirements for Solder Paste Printing

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J-STD-004B w/Amend 1: Requirements for Soldering Fluxes - includes Amendment 1

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IPC-AJ-820A: Assembly & Joining Handbook

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IPC-HDBK-001E: Superseded by HDBK-001F: Handbook and Guide to Supplement J-STD-001

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J-STD-005A: Requirements for Soldering Pastes

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J-STD-033C-HU: A nedvességre/újraömlesztésre érzékeny felületszerelt alkatrészek kezelése, csomagolása, szállítása és használata

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IPC/JEDEC-9704A: Printed Circuit Assembly Strain Gage Test Guideline

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IPC/WHMA-A-620 Test Data Tables

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IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...

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IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

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IPC-A-610DC-Telecom Addendum

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IPC-6017: Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices

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IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability

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IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components

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IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium