J-STD-001F-AM1-FR: Exigences des Assemblages Électriques et Électroniques Brasés
48 Products
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IPC-A-610F-AM1-FR: Acceptabilité des Assemblages Électroniques
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IPC-1072: Intellectual Property Protection in Electronic Assembly Manufacturing
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IPC-HDBK-4691: Handbook on Adhesive Bonding in Electronic Assembly Operations
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IPC-4103 WAM1 - AM2: Amendment 2 to Specification for Base Materials for High Speed/High Frequency...
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J-STD-001F AM1: Requirements for Soldered Electrical and Electronic Assemblies - Amendment 1
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IPC-6903: Terms and Definitions for the Design and Manufacture of Printed Electronics (Additive Circuitry)
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IPC-6012D-Redline: Qualification and Performance Specification for Rigid Printed Boards-Red Line
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IPC-6012DS: Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid...
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IPC-6012D: Qualification and Performance Specification for Rigid Printed Boards
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IPC-6012D-FR: Spécification de la Qualification et des Performances des Circuits Imprimés Rigides
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IPC/JPCA-6901: Application Categories for Printed Electronics
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IPC-T-50M-FR: Termes et Définitions pour les Circuits Électroniques Imprimés et Assemblés
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IPC-T-50M: Terms and Definitions for Interconnecting and Packaging Electronic Circuits
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IPC-7801: Reflow Oven Process Control Standard
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IPC-7092: Design and Assembly Process Implementation for Embedded Components
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IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
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IPC-2221B-FR: Norme Générique de Conception du Circuit imprimé
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IPC/WHMA-A-620B-Redline
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IPC/WHMA-A-620B-KR: 케이블과 와이어 하네스 어셈블리들에 대한 요건들과 수용
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IPC/WHMA-A-620B-FR: Exigences et critères d'acceptabilité pour l'interconnexion des faisceaux de fils et de câbles
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IPC/WHMA-A-620B: Superseded by IPC/WHMA-A-620C: IPC/WHMA-A-620B Requirements and Acceptance for Cable and Wire Harness Assemblies
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IPC/JPCA-4921: Requirements for Printed Electronics Base Materials (Substrates)
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IPC/WHMA-A-620AS-AM1: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A