51 Products

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IPC/JEDEC-9301: Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability

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IPC-6012DA-WAM1: Automotive Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards

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IPC-J-STD-001G-AM1: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-4204B: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

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IPC-1791: Trusted Electronic Designer, Fabricator and Assembler Requirements

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IPC/JEDEC-9707-AM1: Spherical Bend Test Method for Characterization of Board Level Interconnects

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IPC/WHMA-A-620 Test Data Tables

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IPC/WHMA-A-620B-Redline

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IPC/WHMA-A-620AS-AM1: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A

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IPC/JEDEC J-STD-609A Errata Information

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IPC-A-610E-RL: Acceptability of Electronic Assemblies

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IPC-A600H-Errata: IPC-A-600H Errata Information

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IPC-J-STD-001E-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline

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IPC-J-STD-001ES: Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic...

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IPC-4412B-AM2: Specification for finished Fabric Woven from "E" Glass for Printed Boards

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IPC-HDBK-620: Handbook and Guide to IPC-D-620 & IPC/WHMA-A-620

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IPC-9121-AM1: Troubleshooting for PCB Fabrication Processes, Amendment 1

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IPC-1753-WAM 1: Laboratory Report Standard - English

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Qualification and Performance Specification for Flexible and Rigid-Flexible Printed Boards

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IPC-1752A WAM1,2 & 3: Materials Declaration Management Standard

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IPC/WHMA-A-620C-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620C

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IPC/JEDEC J-STD-033D: Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices

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IPC-2292: Design Standard for Printed Electronics on Flexible Substrates

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IPC-7094A: Design and Assembly Process Implementation for Flip Chip and Die-Size Components - English