IPC-6012D-AM1: リジッドプリント板の認定および性能仕様-改定1
31 Products
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IPC-6012D: リジッドプリント板の認定および性能仕様
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IPC/WHMA-A-620C: 케이블 및 와이어 하네스 어셈블리들에 대한 요건들 및 수용
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IPC-J-STD-001G: 솔더링된 전기 및 전자 어셈블리들에 대한 요건들
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IPC-7711/21C: 전자 어셈블리들의 리웤, 변경 및 수리
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IPC-A-610G: 전자 어셈블리들의 허용 가능성
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IPC-7711/21C: 電子組立品のリワーク、改造およびリペア
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J-STD-001G: はんだ付される電気及び電⼦組立品に関する要件事項
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IPC-A-610G: 電子組立品の許容基準
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IPC-4103B: Specification for Base Materials for High Speed/High Frequency Applications
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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English [DRM...
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IPC-J-STD-001G-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline - English
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IPC-A-610G-RL: Acceptability of Electronic Assemblies-Redline
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IPC-J-STD-003C-WAM1&2: Solderability Tests for Printed Boards - English
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IPC-A-610G: Acceptability of Electronic Assemblies
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J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies
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IPC-7091: Design and Assembly Process Implementation of 3D Components
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IPC-4552A: Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
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IPC-A-610F-Russian: Критерии приемки электронных сборок
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IPC-7711/21C REDLINE: Rework, Modification and Repair of Electronic Assemblies - Redline
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IPC-1072AM1: Intellectual Property Protection in Electronic Assembly Manufacturing
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IPC-1755 WAM1-2: IPC-1755 WAM1&2 Conflict Minerals Data Exchange Standard
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IPC-7530A: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes
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IPC/WHMA-A-620C REDLINE: Requirements and Acceptance for Cable and Wire Harness Assemblies