320 Products

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IPC-A-610DC-Telecom Addendum

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IPC-A600H-Errata: IPC-A-600H Errata Information

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IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium

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IPC-TR-464-AM1: Accelerated Aging for Solderability Evaluations-Addendum

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IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...

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IPC-J-STD-004B-AM1: Requirements for Soldering Fluxes

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IPC-J-STD-003C: Solderability Tests for Printed Boards Amendment 1

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IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014

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IPC-J-STD-001E-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline

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IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

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IPC-J-STD-001ES: Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic...

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IPC-4412B-AM2: Specification for finished Fabric Woven from "E" Glass for Printed Boards

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IPC-HDBK-620: Handbook and Guide to IPC-D-620 & IPC/WHMA-A-620

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IPC-9121-AM1: Troubleshooting for PCB Fabrication Processes, Amendment 1

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IPC-1753-WAM 1: Laboratory Report Standard - English

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Qualification and Performance Specification for Flexible and Rigid-Flexible Printed Boards

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IPC-9691B: IPC-TM-650 测试方法2.6.25耐导电阳极丝(CAF)及其他内部电化学迁移(ECM)测试用户指南

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IPC-1752A WAM1,2 & 3: Materials Declaration Management Standard

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IPC/WHMA-A-620C-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620C

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IPC/JEDEC J-STD-033D: Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices

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IPC-2292: Design Standard for Printed Electronics on Flexible Substrates

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IPC-J-STD-001G: 焊接的电⽓和电⼦组件要求

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IPC-7094A: Design and Assembly Process Implementation for Flip Chip and Die-Size Components - English

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IPC-7621: Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly...