360 Products

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Nonmember: $137.00

IPC-1752A WAM1,2 & 3: Materials Declaration Management Standard

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Nonmember: $95.00

IPC/WHMA-A-620C-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620C

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IPC-WHMA-A-620C-Space: 航天应用电子部件补充标准

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IPC-J-STD-033D: 潮湿、再流焊和工艺敏感器件的操作、包装、运输及使用

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Nonmember: $93.00

IPC/JEDEC J-STD-033D: Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices

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IPC-2292: Design Standard for Printed Electronics on Flexible Substrates

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IPC-2224: Sectional Standard of Design of PWBs for PC Cards - English

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IPC/PERM-2901: Pb-free Design and Assembly Implementation Guide - English

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IPC-CC-830C: 印制线路组件用电气绝缘化合物的鉴定及性能

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IPC-7094A: Design and Assembly Process Implementation for Flip Chip and Die-Size Components - English

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IPC-7621: Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly...

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IPC-6903A: Terms and Definitions for the Design and Manufacture of Printed Electronics - English

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IPC-4591A: Requirements for Printed Electronics Functional Conductive Materials

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IPC-6903A: 印刷电子设计与生产的术语及定义

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IPC-J-STD-002E: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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IPC-4103B: Specification for Base Materials for High Speed/High Frequency Applications

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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English [DRM...

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IPC-J-STD-001G-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline - English

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IPC-A-610G-RL: Acceptability of Electronic Assemblies-Redline

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IPC-6012D: Specyfikacja Zdolności i Osiągów dla Sztywnych Płyt Drukowanych

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IPC-A-610G: Acceptability of Electronic Assemblies

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J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-J-STD-001G: 焊接的电⽓和电⼦组件要求

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IPC-A-610G: Dopuszczalność Zespołów Elektronicznych