238 Products

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IPC-4103B: Specification for Base Materials for High Speed/High Frequency Applications

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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English [DRM...

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IPC-J-STD-001G-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline - English

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IPC-A-610G-RL: Acceptability of Electronic Assemblies-Redline

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IPC-J-STD-003C-WAM1&2: Solderability Tests for Printed Boards - English

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IPC-A-610G: Acceptability of Electronic Assemblies

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J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-7091: Design and Assembly Process Implementation of 3D Components

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IPC-4552A: Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards

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IPC-7711/21C REDLINE: Rework, Modification and Repair of Electronic Assemblies - Redline

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IPC-D-326A: Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Assemblies

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IPC-HDBK-610: Handbook and Guide to Supplement IPC-A-610 (Includes IPC-A-610 B-C-D Comparisons) with Amendment 1

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J-STD-001D: Rev D superseded by Rev E

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J-006A: SUPERSEDED BY J-STD-006B

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D-859: Design Standard for Thick Film Multilayer Hybrid Circuits

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D-390A: Automated Design Guidelines

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D-322: Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes

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D-310C: Guidelines for Phototool Generation and Measurement Techniques

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IPC-TF-870: Qualification and Performance of Polymer Thick Film Printed Boards

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IPC-SM-780: Component Packaging & Interconnecting with Emphasis on Surface Mounting

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IPC-S-816: SMT Process Guideline Checklist

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QF-143: Specifications for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards

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IPC-SG-141: Specification for Finished Fabric Woven from "S" Glass for Printed Boards

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IPC-OI-645: Standard for Visual Optical Inspection Aids