IPC-J-STD-006C-Japanese: 電子グレードはんだ合金、および電子はんだ付用やに入り/やになし固体はんだに関する要求事項

IPC-4556: 印制板化学镍/钯/浸金（ENEPIG）规范

IPC/WHMA-A-620 Test Data Tables

IPC/WHMA-A-620B-Redline

IPC/WHMA-A-620B-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B

IPC/WHMA-A-620AS-AM1: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A

IPC/JEDEC J-STD-609A Errata Information

IPC/WHMA-A-620B-AM1: Requirements and Acceptance for Cable and Wire Harness Assemblies

IPC-A-610DC-Telecom Addendum

IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium

IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...

IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

IPC-7527: 焊膏印刷要求 - Chinese

IPC-7095C-CN: BGA设计与组装工艺的实施

A-620B-EE: Juhtme- ja kaablikoostude vastavusnõuded

A-620B-TR: Kablo ve Kablo Takımları için Kabul Gereklilikleri

A-620B-IL: IPC/WHMA-A-620B Requirements and Acceptance for Cable and Wire Harness Assemblies

IPC/WHMA-A-620B-KR: 케이블과 와이어 하네스 어셈블리들에 대한 요건들과 수용

IPC-A-610D-VN: Acceptability of Electronic Assemblies

IPC/WHMA-A-620B-VN: Yêu Cầu và Tiêu Chuẩn Chấp Nhận cho Các Bộ Dây và Bộ Cáp...

IPC-7711/21B-SW: Rework, Modification and Repair of Electronic Assemblies

J-STD-001D-SW: Requirements for Soldered Electrical and Electronic Assemblies

IPC-A-610D-SW: Acceptability of Electronic Assemblies

A-600GPL(D)1: Acceptability of Printed Boards