41 Products

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IPC-A-610E-RL: Acceptability of Electronic Assemblies

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IPC-A600H-Errata: IPC-A-600H Errata Information

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IPC-J-STD-001E-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline

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IPC-J-STD-001ES: Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic...

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IPC-4103B: Specification for Base Materials for High Speed/High Frequency Applications

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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English [DRM...

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IPC-J-STD-001G-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline - English

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IPC-A-610G-RL: Acceptability of Electronic Assemblies-Redline

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IPC-J-STD-003C-WAM1&2: Solderability Tests for Printed Boards - English

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IPC-A-610G: Acceptability of Electronic Assemblies

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J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-7091: Design and Assembly Process Implementation of 3D Components

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IPC-4552A: Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards

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IPC-7711/21C REDLINE: Rework, Modification and Repair of Electronic Assemblies - Redline

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D-322: Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes

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QF-143: Specifications for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards

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IPC-SG-141: Specification for Finished Fabric Woven from "S" Glass for Printed Boards

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IPC-D-352: Electronic Design Data Description for Printed Boards in Digital Form

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IPC-D-351: Printed Board Drawings in Digital Form

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IPC-D-350D: Printed Board Description in Digital Form

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C-406: Design & Application Guidelines for Surface Mount Connectors

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IPC-5704: Cleanliness Requirements for Unpopulated Printed Boards

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A-142: Specification for Finished Fabric Woven from Aramid for Printed Boards

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1756: Manufacturing Process Data Management