IPC-2615: Printed Board Dimensions and Tolerances

IPC-1731: 1731 - Strategic Raw Materials Supplier Qualification Profile

IPC-4121: Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications

IPC-4130: Specification & Characterization Methods for Nonwoven "E" Glass Mat

IPC-4110: Specification & Characterization Methods for Non Woven Cellulose Based Paper for Printed Boards

IPC-2225: Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies

IPC-6015: Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting & Interconnecting Structures

IPC-DR-570A: General Specification for 1/8 inch Diameter Shank Carbide Drills for Printed Boards

IPC-CI-408: Design & Application Guidelines for the Use of Solderless Surface Mount Connectors

IPC-D-352: Electronic Design Data Description for Printed Boards in Digital Form

IPC-D-351: Printed Board Drawings in Digital Form