18 Products

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IPC-A-610DC-Telecom Addendum

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IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium

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IPC-TR-464-AM1: Accelerated Aging for Solderability Evaluations-Addendum

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IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...

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IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

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IPC-7711/21B-SW: Rework, Modification and Repair of Electronic Assemblies

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A-600GPL(D)1: Acceptability of Printed Boards

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IPC/WHMA-A-620A-PL: Rev A superseded by Rev B

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J-STD-004B-CN: 修订本 1 助焊剂要求

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J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...

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T-50H-CN: 电子电路互连与封装术语及定义

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J-STD-075-DE: Classification of Non-IC Electronic Components for Assembly Processes

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IPC-HM-860: Specification for Multilayer Hybrid Circuits

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IPC-D-354: Library Format Description for Printed Boards in Digital Form

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IPC-CF-152B: Composite Metallic Materials Specification for Printed Wiring Boards

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IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability

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IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components

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IPC-6017: Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices