IPC-6018CS: 6018C高频（微波）印制板的鉴定及性能规范航天和军事航空电子应用补充标准

IPC-4202B: 挠性印制板用挠性基底电介质

IPC-A-600J: 印製板的可接受性

IPC-1601A: Wytyczne dla obsługiwania i przechowywania płyt drukowanych

IPC-1782: 电子产品的制造和供应链可追溯性标准

IPC-A-600J: Kryteria Dopuszczenia Płyt Drukowanych

IPC-1601A: 印制板操作和储存指南

IPC-6018C: 高频（微波）印制板的鉴定及性能规范

IPC-9121: 印制板制造工艺问题解答

IPC-4556: 印制板化学镍/钯/浸金（ENEPIG）规范

IPC-1601A: Guía para el manejo y almacenamiento de tarjetas impresas

IPC/WHMA-A-620B-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B

IPC/WHMA-A-620B-AM1: Requirements and Acceptance for Cable and Wire Harness Assemblies

IPC-A-610DC-Telecom Addendum

IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium

IPC-TR-464-AM1: Accelerated Aging for Solderability Evaluations-Addendum

IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...

IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

IPC-9691B: IPC-TM-650 测试方法2.6.25耐导电阳极丝（CAF）及其他内部电化学迁移（ECM）测试用户指南

IPC-7095C-CN: BGA设计与组装工艺的实施

IPC-7711/21B-TR: Elektronik Takımlarda Yeniden İşlem, Modifikasyon ve Onarım

IPC-A-610F-TR: Ek1'i içerir

IPC-7711/21B-KR: 전자 어셈블리의 리웍, 수정 및 수리

IPC-A-610D-VN: Acceptability of Electronic Assemblies