25 Products

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IPC-A-610DC-Telecom Addendum

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IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium

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IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...

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IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

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IPC-7711/21B-SW: Rework, Modification and Repair of Electronic Assemblies

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A-600GPL(D)1: Acceptability of Printed Boards

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IPC/WHMA-A-620A-PL: Rev A superseded by Rev B

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IPC-A-600G-CH: Acceptability of Printed Boards

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J-STD-004B-CN: 修订本 1 助焊剂要求

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J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...

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T-50H-CN: 电子电路互连与封装术语及定义

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J-STD-075-DE: Classification of Non-IC Electronic Components for Assembly Processes

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IPC-S-816: SMT Process Guideline Checklist

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IPC-OI-645: Standard for Visual Optical Inspection Aids

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IPC/JEDEC-J-STD-035: Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components

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IPC-DR-570A: General Specification for 1/8 inch Diameter Shank Carbide Drills for Printed Boards

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D-356B: Bare Substrate Electrical Test Data Format

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IPC-CI-408: Design & Application Guidelines for the Use of Solderless Surface Mount Connectors

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IPC-9502: PWB Assembly Soldering Process Guideline for Electronic Components

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IPC-9199: Statistical Process Control (SPC) Quality Rating

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IPC-9191: General Guidelines for Implementation of Statistical Process Control (SPC)

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IPC-2252: Design Guide for RF/Microwave Circuit Boards

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IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability

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IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components