IPC-7711/21C: Rework, modificatie en repair van elektronische assemblages - Chapter 1
32 Products
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IPC-J-STD-001G: Các Yêu Cầu Cho Các Sản Phẩm Điện và Điện Tử Hàn Lắp Ráp
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IPC-A-610G: Tiêu Chuẩn Chấp Nhận Các Sản Phẩm Lắp Ráp Điện Tử
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IPC/WHMA-A-620C: Yêu Cầu và Tiêu Chuẩn Chấp Nhận cho Các Bộ Dây và Bộ Cáp...
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IPC-A-610G: Acceptatie van geassembleerde printplaten
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IPC-J-STD-001G: Eisen voor gesoldeerde elektrische en elektronische geassembleerde printplaten
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IPC/WHMA-A-620C: Eisen en acceptatie van kabel en draadboom assemblages
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IPC-4103B: Specification for Base Materials for High Speed/High Frequency Applications
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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English [DRM...
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IPC-J-STD-001G-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline - English
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IPC-A-610G-RL: Acceptability of Electronic Assemblies-Redline
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IPC-J-STD-003C-WAM1&2: Solderability Tests for Printed Boards - English
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IPC-A-610G: Acceptability of Electronic Assemblies
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J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies
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IPC-7091: Design and Assembly Process Implementation of 3D Components
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IPC-4552A: Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
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IPC-7711/21C REDLINE: Rework, Modification and Repair of Electronic Assemblies - Redline
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IPC-DR-570A: General Specification for 1/8 inch Diameter Shank Carbide Drills for Printed Boards
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IPC-CI-408: Design & Application Guidelines for the Use of Solderless Surface Mount Connectors
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IPC-4121: Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications
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IPC-2615: Printed Board Dimensions and Tolerances
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IPC-1731: 1731 - Strategic Raw Materials Supplier Qualification Profile
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IPC-1755 WAM1-2: IPC-1755 WAM1&2 Conflict Minerals Data Exchange Standard
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IPC-7530A: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes