98 Products

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IPC-T-50M: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

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J-STD-048: Notification Standard for Product Discontinuance

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IPC-1755 Amendment 1: Conflict Minerals Data Exchange Standard Amendment 1

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IPC-7801: Reflow Oven Process Control Standard

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IPC-7801: 再流焊炉工艺控制标准 - Chinese

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IPC-7092: Design and Assembly Process Implementation for Embedded Components

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IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices

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J-STD-001FS-SP: Adición de dispositivos electrónicos para aplicaciones espaciales del IPC J-STD-001F Requisitos Para Uniones Eléctricas...

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IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives

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IPC-FC-234A: Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards

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J-STD-001F: J-STD-001 Revision E to Revision F Redline Comparison Document

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IPC-A-610F: IPC-A-610 Revision E to Revision F Redline Comparison Document

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IPC-A-610F-VN: Yêu Cầu Chấp Nhận Cho Các Lắp Ráp Điện Tử

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IPC-A-610F-RO: Acceptabilitatea Ansamblurilor Electronice

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IPC-A-610F-DK: Godkendelseskrav for elektronikprodukter

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IPC-SM-817A-CN: 表面贴装用绝缘粘合剂通用规范

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IPC-A-610F-FR: Acceptabilité des assemblages électroniques

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IPC-A-610F-DE: Abnahmekriterien für elektronische Baugruppen

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IPC-A-610F: Acceptability of Electronic Assemblies

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J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-A-610F-SP: Aceptabilidad de Ensambles Electrónicos

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J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

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IPC-HDBK-630: Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures

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IPC-8701: Final Acceptance Criteria Standard for PV Modules-Final Module Assembly