47 Products

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IPC-6012DS: Dodatek do Aplikacji Kosmicznych i Awioniki Wojskowej dla dokumentu IPC-6012D - Specyfikacji Zdolności i...

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IPC-6012DS: リジッドプリント板の認定および性能仕様宇宙・軍用アビオニクス用途向け追加規格

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IPC-A-610DC-Telecom Addendum

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IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium

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IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...

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IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

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IPC-7801: 再流焊炉工艺控制标准 - Chinese

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IPC-6012DS-CN: 刚性印制板的鉴定及性能规范航天和军事航空电子应用补充标准

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J-STD-001F-AM1-FR: Exigences des Assemblages Électriques et Électroniques Brasés

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IPC-A-610F-AM1-FR: Acceptabilité des Assemblages Électroniques

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IPC-7711/21B-SW: Rework, Modification and Repair of Electronic Assemblies

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J-STD-001F-AM1-RO: Cerințe pentru Ansamblurile Electrice și Electronice Lipite

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A-600GPL(D)1: Acceptability of Printed Boards

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IPC/WHMA-A-620A-PL: Rev A superseded by Rev B

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J-STD-004B-CN: 修订本 1 助焊剂要求

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IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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IPC/JEDEC-J-STD-020E-CN: 非气密表面贴装器件潮湿/再流焊敏感度分级

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IPC-A-610F AM1-CN: 电子组件的可接受性 修订本1

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IPC-6012D-CN: 刚性印制板的鉴定及性能规范

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J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...

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T-50H-CN: 电子电路互连与封装术语及定义

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J-STD-001FS-SP: Adición de dispositivos electrónicos para aplicaciones espaciales del IPC J-STD-001F Requisitos Para Uniones Eléctricas...

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IPC-6012DS-SP: Adición de aplicaciones de aviónica militar y espacial del IPC-6012D, Clasificación y especificación de...

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IPC-6012D-FR: Spécification de la Qualification et des Performances des Circuits Imprimés Rigides