J-STD-001F-AM1-FR: Exigences des Assemblages Électriques et Électroniques Brasés

IPC-A-610F-AM1-FR: Acceptabilité des Assemblages Électroniques

IPC-6012D-FR: Spécification de la Qualification et des Performances des Circuits Imprimés Rigides

IPC-T-50M-FR: Termes et Définitions pour les Circuits Électroniques Imprimés et Assemblés

IPC-DR-570A: General Specification for 1/8 inch Diameter Shank Carbide Drills for Printed Boards

IPC-CI-408: Design & Application Guidelines for the Use of Solderless Surface Mount Connectors

IPC-1072: Intellectual Property Protection in Electronic Assembly Manufacturing

IPC-HDBK-4691: Handbook on Adhesive Bonding in Electronic Assembly Operations

IPC-4103 WAM1 - AM2: Amendment 2 to Specification for Base Materials for High Speed/High Frequency...

J-STD-001F AM1: Requirements for Soldered Electrical and Electronic Assemblies - Amendment 1

IPC-6903: Terms and Definitions for the Design and Manufacture of Printed Electronics (Additive Circuitry)

IPC-6012D-Redline: Qualification and Performance Specification for Rigid Printed Boards-Red Line

IPC-6012DS: Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid...

IPC-6012D: Qualification and Performance Specification for Rigid Printed Boards

IPC/JPCA-6901: Application Categories for Printed Electronics

IPC-T-50M: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

J-STD-048: Notification Standard for Product Discontinuance

IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices

IPC-1755 Amendment 1: Conflict Minerals Data Exchange Standard Amendment 1

IPC-7801: Reflow Oven Process Control Standard

IPC-7092: Design and Assembly Process Implementation for Embedded Components