IPC-A-610DC-Telecom Addendum

IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium

IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...

IPC-J-STD-004B-AM1: Requirements for Soldering Fluxes

IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

IPC-CH-65B-CN: 印制板及组件清洗指南

IPC-7093-CN: 底部端子元器件(BTC)设计和组装工艺的实施

IPC-7525B-CN: 模板设计指导

J-STD-004B-CN: 修订本 1 助焊剂要求

IPC-6018B-CN: 高频（微波）印制板的鉴定及性能规范

J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...

T-50H-CN: 电子电路互连与封装术语及定义

IPC-CF-152B: Composite Metallic Materials Specification for Printed Wiring Boards

IPC-9709: Test Guidelines for Acoustic Emission Measurement during Mechanical Testing

IPC-CH-65B: Guidelines for Cleaning of Printed Boards and Assemblies

IPC/JEDEC-9707: Spherical Bend Test Method for Characterization of Board Level Interconnects

JIG101ED4: Joint Industry Guide Materials Composition Declaration for Electrotechnical Products

IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability

IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components

IPC-6017: Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices

IPC-9850A: Surface Mount Placement Equipment Characterization

IPC-9202: Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance

IPC-T-50J: SUPERSEDED BY T-50K

IPC-7525B: Stencil Design Guidelines