73 Products

Member: $84.00

Nonmember: $168.00

T-50H-CN: 电子电路互连与封装术语及定义

Member: $61.00

Nonmember: $116.00

IPC-WHMA-A-620A-CN: Rev A superseded by Rev B

Member: $79.00

Nonmember: $155.00

2221A-CH: Generic Standard on Printed Board Design

Member: $61.00

Nonmember: $116.00

IPC/WHMA-A-620A-SP: Requerimientos y Aceptación para Ensamble de Arneses de Cable y Alambre

Member: $246.00

Nonmember: $490.00

IPC-7711/21B-FR: Reprise, Modification et Réparation des Assemblages Electroniques

Member: $246.00

Nonmember: $490.00

IPC-7711/21B-IT: Rilavorazione, Modifica e Riparazione di Assemblati Elettronici

Member: $84.00

Nonmember: $168.00

J-STD-001D-IT: Requirements for Soldered Electrical and Electronic Assemblies

Member: $246.00

Nonmember: $490.00

IPC-7711/21B-DE: Nacharbeit, Änderung und Reparatur von elektronischen Baugruppen

Member: $123.00

Nonmember: $246.00

IPC-2221A-DE: SUPERSEDED BY IPC-2221B-DE

Member: $67.00

Nonmember: $135.00

IPC-2223A-DE: Sectional Design Standard for Flexible Printed Boards

Member: $67.00

Nonmember: $135.00

J-STD-075-DE: Classification of Non-IC Electronic Components for Assembly Processes

Member: $47.00

Nonmember: $93.00

IPC-DR-572A: Drilling Guidelines for Printed Boards

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Nonmember: $168.00

IPC-2316: Design Guide for Embedded Passive Device Printed Boards

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Nonmember: $0.00

IPC-7526: Stencil and Misprinted Board Cleaning Handbook

Member: $47.00

Nonmember: $93.00

IPC-6015: Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting & Interconnecting Structures

Member: $47.00

Nonmember: $93.00

IPC-4130: Specification & Characterization Methods for Nonwoven "E" Glass Mat

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Nonmember: $93.00

IPC-4110: Specification & Characterization Methods for Non Woven Cellulose Based Paper for Printed Boards

Member: $65.00

Nonmember: $131.00

IPC-2225: Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies

Member: $84.00

Nonmember: $168.00

IPC-9201A: Surface Insulation Resistance Handbook

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IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability

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Nonmember: $168.00

IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components

Member: $47.00

Nonmember: $93.00

IPC-5702: Guidelines for OEMs in Determining Acceptable Levels of Cleanliness of Unpopulated Printed Boards

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Nonmember: $93.00

IPC-6017: Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices

Member: $168.00

Nonmember: $335.00

IPC-7711/21B: Rework, Modification and Repair of Electronic Assemblies