28 Products

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IPC-J-STD-004B-AM1: Requirements for Soldering Fluxes

Member: $47.00

Nonmember: $93.00

9702-CN: 板极互连的单向弯曲特性描述

Member: $84.00

Nonmember: $168.00

IPC-CH-65B-CN: 印制板及组件清洗指南

Member: $84.00

Nonmember: $168.00

IPC-7093-CN: 底部端子元器件(BTC)设计和组装工艺的实施

Member: $47.00

Nonmember: $93.00

IPC-7525B-CN: 模板设计指导

Member: $65.00

Nonmember: $131.00

IPC-6018B-CN: 高频(微波)印制板的鉴定及性能规范

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IPC-1720A-CN: 组装资格认证纲要

Member: $123.00

Nonmember: $246.00

IPC-A-600G-IT/EK: Acceptability of Printed Boards

Member: $67.00

Nonmember: $135.00

IPC-7525B-DE: Designrichtlinie für Druckschablonen

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Nonmember: $93.00

IPC-D-326A: Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Assemblies

Member: $84.00

Nonmember: $168.00

IPC-CM-770E: Component Mounting Guidelines for Printed Boards

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Nonmember: $131.00

IPC-9194: Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline

Member: $47.00

Nonmember: $93.00

IPC-7912A: End-Item DPMO for Printed Circuit Board Assemblies

Member: $47.00

Nonmember: $93.00

IPC-4121: Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications

Member: $65.00

Nonmember: $131.00

IPC-2615: Printed Board Dimensions and Tolerances

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IPC-2141A: Design Guide for High-Speed Controlled Impedance Circuit Boards

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IPC-1731: 1731 - Strategic Raw Materials Supplier Qualification Profile

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IPC-1720A: Assembly Qualification Profile

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IPC-1710A: OEM Standard for Printed Board Manufacturer's Qualification Profile (MQP)

Member: $84.00

Nonmember: $168.00

IPC-9709: Test Guidelines for Acoustic Emission Measurement during Mechanical Testing

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Nonmember: $168.00

IPC-CH-65B: Guidelines for Cleaning of Printed Boards and Assemblies

Member: $84.00

Nonmember: $168.00

IPC/JEDEC-9707: Spherical Bend Test Method for Characterization of Board Level Interconnects

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JIG101ED4: Joint Industry Guide Materials Composition Declaration for Electrotechnical Products

Member: $84.00

Nonmember: $168.00

IPC-9850A: Surface Mount Placement Equipment Characterization