IPC-2591-Version 1.1: Connected Factory Exchange (CFX)
IPC-8921: Requirements for Woven and Knitted Electronic Textiles (E-Textiles) Integrated with Conductive Fibers, Conductive Yarns...
IPC-9121-AM2: Troubleshooting for Printed Board Fabrication Processes, Amendment 2
IPC-7095D-WAM1: Design and Assembly Process Implementation for BGAs, with Amendment 1
IPC-HERMES-9852: The Global Standard for Machine-to-Machine Communication in SMT Assembly
IPC-2231: DFX Guidelines
IPC-1754-WAM1: Materials and Substances Declaration for Aerospace and Defense and Other Industries
IPC-1791-Amendment 1: Trusted Electronic Designer, Fabricator and Assembler Requirements, Amendment 1
IPC-2591: Connected Factory Exchange (CFX)
IPC-9111:Troubleshooting for Printed Board Assembly Processes
IPC-CC-830C: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
J-STD-004B-CN: 修订本 1 助焊剂要求
IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...
IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies
J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...
IPC-6017: Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices
IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability
IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components