IPC/WHMA-A-620A-DE: Rev A superseded by Rev B

IPC-9252A-CN: 未组装印制板电气测试要求

IPC-CC-830B-CN WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...

REACHGUIDE08: REACH & The Electronics Industry Supply Chain: The Basics, the Impact and How to...

IPC-CC-830B WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...

J-STD-075-CN: 组装工艺中非IC电子元器件的分级

IPC-6012B-SW: Qualification and Performance Specification for Rigid Printed Boards

IPC-A-600G-SW: Acceptability of Printed Boards

7351A-DE: SUPERSEDED BY 7351B-DE

J-STD-075: Classification of Non-IC Electronic Components for Assembly Processes

IPC-J-STD-004B-WAM1: はんだ付用フラックスに関する要求事項

IPC-J-STD-075-Spanish: Clasificación de componentes electrónicos no-IC para procesos de ensamble

IPC-CC-830B-AM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

IPC-A-610D-CZ: Acceptability of Electronic Assemblies

J-004A-CN: SUPERSEDED BY J-STD-004B-CN

J-STD-005-CN WAM1: Requirements for Soldering Pastes - includes Amendment 1

4562A-CN: 印制板用金属箔

IPC-4781: Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend and/or Marking Ink

IPC-4811: Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards

J-STD-001D-DE: Requirements for Soldered Electrical and Electronic Assemblies

J-STD-005-JP: Requirements for Soldering Pastes - Includes Amendment 1

J-STD-004A-JP: Requirements for Soldering Fluxes

J-STD-001D-JP: Requirements for Soldered Electrical and Electronic Assemblies

IPC-A-600G-JP/EK: Acceptability of Printed Boards