16 Products

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Nonmember: $246.00

IPC-A-610E-JP: 電子組立品の許容基準

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IPC-A-610F-JP: 電子組立部品の許容基準

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A-610DJP(D)1: Acceptability of Electronic Assemblies

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J-STD-005-JP: Requirements for Soldering Pastes - Includes Amendment 1

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J-STD-004A-JP: Requirements for Soldering Fluxes

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J-STD-001D-JP: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-A-600G-JP/EK: Acceptability of Printed Boards

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IPC-A-610E-HI: इलेक्ट्रोनिक असेम्बलीज की स्वीकार्यता

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7351B-DE: Basisanforderungen an das SMT-Design und SMD-Anschlussflächen-Richtlinie

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IPC-1601-DE: Handhabung und Lagerung von Leiterplatten

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J-STD-001D-DE: Requirements for Soldered Electrical and Electronic Assemblies

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IPC/JEDEC-J-STD-020D-DE: IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

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7351A-DE: SUPERSEDED BY 7351B-DE

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IPC/WHMA-A-620A-DE: Rev A superseded by Rev B

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IPC-6012D-DE: Qualifikation und Leistungsspezifikation für starre Leiterplatten

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IPC-A-610E-DE: Abnahmekriterien für elektronische Baugruppen