IPC-9850A: Surface Mount Placement Equipment Characterization

IPC-6018B-CN: 高频（微波）印制板的鉴定及性能规范

IPC-J-STD-004B-AM1: Requirements for Soldering Fluxes

IPC-7525B-CN: 模板设计指导

IPC-7525B-DE: Designrichtlinie für Druckschablonen

IPC-7525B: Stencil Design Guidelines

IPC-9202: Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance

IPC-T-50J: SUPERSEDED BY T-50K

IPC-9709: Test Guidelines for Acoustic Emission Measurement during Mechanical Testing

IPC/JEDEC-9707: Spherical Bend Test Method for Characterization of Board Level Interconnects

JIG101ED4: Joint Industry Guide Materials Composition Declaration for Electrotechnical Products

IPC-CH-65B-CN: 印制板及组件清洗指南

IPC-CH-65B: Guidelines for Cleaning of Printed Boards and Assemblies

IPC-7093-CN: 底部端子元器件(BTC)设计和组装工艺的实施

IPC-7093: Design and Assembly Process Implementation for Bottom Termination Components

IPC/WHMA-A-620A-DE: Rev A superseded by Rev B

IPC-9252A-CN: 未组装印制板电气测试要求

IPC-CC-830B-CN WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...

REACHGUIDE08: REACH & The Electronics Industry Supply Chain: The Basics, the Impact and How to...

IPC-CC-830B WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...

J-STD-075-CN: 组装工艺中非IC电子元器件的分级

IPC-6012B-SW: Qualification and Performance Specification for Rigid Printed Boards

IPC-A-600G-SW: Acceptability of Printed Boards

7351A-DE: SUPERSEDED BY 7351B-DE