IPC-6018B-CN: 高频（微波）印制板的鉴定及性能规范
16 Products
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IPC-7525B-CN: 模板设计指导
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IPC-7525B-DE: Designrichtlinie für Druckschablonen
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IPC-CH-65B-CN: 印制板及组件清洗指南
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IPC-7093-CN: 底部端子元器件(BTC)设计和组装工艺的实施
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IPC/WHMA-A-620A-DE: Rev A superseded by Rev B
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IPC-9252A-CN: 未组装印制板电气测试要求
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IPC-CC-830B-CN WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...
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J-STD-075-CN: 组装工艺中非IC电子元器件的分级
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7351A-DE: SUPERSEDED BY 7351B-DE
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J-004A-CN: SUPERSEDED BY J-STD-004B-CN
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J-STD-005-CN WAM1: Requirements for Soldering Pastes - includes Amendment 1
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4562A-CN: 印制板用金属箔
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J-STD-001D-DE: Requirements for Soldered Electrical and Electronic Assemblies
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IPC/JEDEC-J-STD-020D-DE: IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
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IPC-7711/21B-CN: 电子组件的返工、修改和维修