IPC-A-610DC-Telecom Addendum
14 Products
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IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium
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IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...
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IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies
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IPC-7711/21B-SW: Rework, Modification and Repair of Electronic Assemblies
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A-600GPL(D)1: Acceptability of Printed Boards
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IPC/WHMA-A-620A-PL: Rev A superseded by Rev B
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J-STD-004B-CN: 修订本 1 助焊剂要求
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J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...
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T-50H-CN: 电子电路互连与封装术语及定义
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J-STD-075-DE: Classification of Non-IC Electronic Components for Assembly Processes
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IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability
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IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components
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IPC-6017: Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices