IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...
11 Products
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IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies
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IPC-A-610DC-Telecom Addendum
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IPC/WHMA-A-620A-PL: Rev A superseded by Rev B
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J-STD-075-DE: Classification of Non-IC Electronic Components for Assembly Processes
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IPC-7711/21B-SW: Rework, Modification and Repair of Electronic Assemblies
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IPC-6017: Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices
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IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability
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IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components
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IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium
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A-600GPL(D)1: Acceptability of Printed Boards