IPC-9111: 印制电路板组装工艺的故障排除

IPC-2591: 互联工厂数据交换（CFX）

IPC-7095D-WAM1: Design and Assembly Process Implementation for BGAs, with Amendment 1

IPC-HERMES-9852: The Global Standard for Machine-to-Machine Communication in SMT Assembly

IPC-2231: DFX Guidelines

IPC-1754-WAM1: Materials and Substances Declaration for Aerospace and Defense and Other Industries

IPC-1791-Amendment 1: Trusted Electronic Designer, Fabricator and Assembler Requirements, Amendment 1

IPC-2591: Connected Factory Exchange (CFX)

IPC-9111:Troubleshooting for Printed Board Assembly Processes

IPC-CC-830C: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

IPC-A-610E-RL: Acceptability of Electronic Assemblies

IPC-A600H-Errata: IPC-A-600H Errata Information

IPC-J-STD-001E-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline

IPC-J-STD-001ES: Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic...

IPC-SM-840E-CN: 永久性阻焊剂和挠性覆盖材料的鉴定和性能规范

IPC/JEDEC-J-STD-020D-1-CN: IPC/JEDEC 非气密固态表面贴装器件潮湿/再流焊敏感度分级

IPC-A-610E-CN: 电子组件的可接受性

J-STD-001E-CN: Rev E superseded by Rev F

IPC-1601-CN: 印制板操作和贮存指南

IPC-5704: Cleanliness Requirements for Unpopulated Printed Boards

1756: Manufacturing Process Data Management

IPC-A-610E: Acceptability of Electronic Assemblies

1751A: Generic Requirements for Declaration Process Management - includes Amendment 1

J-STD-001E: Requirements for Soldered Electrical and Electronic Assemblies