77 Products

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Nonmember: $137.00

IPC-4103B: Specification for Base Materials for High Speed/High Frequency Applications

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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English [DRM...

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IPC-J-STD-001G-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline - English

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IPC-A-610G-RL: Acceptability of Electronic Assemblies-Redline

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IPC-J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-A-610G: Acceptability of Electronic Assemblies - Multi Device License

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IPC-A-610G: Acceptability of Electronic Assemblies

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J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-A-610G: Aceptabilidad de ensambles electrónico

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IPC-A-610G: 電子組立品の許容基準

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IPC-A-610G: Aceptabilidad de ensambles electrónico

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IPC-J-STD-001G: Provee requisitos para materiales de soldadura y procesos para ensambles

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IPC-J-STD-001GS: Adenda para dispositivos electrónicos utilizados en aplicaciones militares y espaciales, realizada al documento IPC...

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IPC-J-STD-001G: Provee requisitos para materiales de soldadura y procesos para ensambles

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J-STD-001G: はんだ付される電気及び電⼦組立品に関する要件事項

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IPC-6012D-AM1: リジッドプリント板の認定および性能仕様-改定1

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IPC-J-STD-003C-WAM1&2: Solderability Tests for Printed Boards - English

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IPC-4552A: Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards

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IPC-7091: Design and Assembly Process Implementation of 3D Components

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IPC-7711/21C REDLINE: Rework, Modification and Repair of Electronic Assemblies - Redline

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IPC-7530A: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

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IPC-7530A: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

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IPC-4101E: Specification for Base Materials for Rigid and Multilayer Printed Boards - Multi Device License

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IPC-1072AM1: Intellectual Property Protection in Electronic Assembly Manufacturing