25 Products

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IPC-6012D-AM1: リジッドプリント板の認定および性能仕様-改定1

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IPC-6012D: リジッドプリント板の認定および性能仕様

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IPC-7711/21C: 電子組立品のリワーク、改造およびリペア

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J-STD-001G: はんだ付される電気及び電⼦組立品に関する要件事項

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IPC-A-610G: 電子組立品の許容基準

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IPC-4103B: Specification for Base Materials for High Speed/High Frequency Applications

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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English [DRM...

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IPC-J-STD-001G-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline - English

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IPC-A-610G-RL: Acceptability of Electronic Assemblies-Redline

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IPC-J-STD-003C-WAM1&2: Solderability Tests for Printed Boards - English

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IPC-A-610G: Acceptability of Electronic Assemblies

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J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-7091: Design and Assembly Process Implementation of 3D Components

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IPC-4552A: Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards

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IPC-7711/21C REDLINE: Rework, Modification and Repair of Electronic Assemblies - Redline

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IPC-1755 WAM1-2: IPC-1755 WAM1&2 Conflict Minerals Data Exchange Standard

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IPC-7530A: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

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IPC/WHMA-A-620C REDLINE: Requirements and Acceptance for Cable and Wire Harness Assemblies

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IPC-9204: Guideline on Flexibility and Stretchability Testing for Printed Electronics

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IPC-1401: Supply Chain Social Responsibility Management System Guidance

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IPC-4101E: Specification for Base Materials for Rigid and Multilayer Printed Boards

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IPC-A-610FC: Telecom Addendum to IPC-A-610 Revision F Acceptability of Electronic Assemblies

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J-STD-001FS WAM 1: Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical...

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IPC-7711/21C: Rework, Modification and Repair of Electronic Assemblies