IPC-4103B: Specification for Base Materials for High Speed/High Frequency Applications

EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English

IPC-A-610G: Acceptability of Electronic Assemblies

J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies

J-STD-006C-AM1: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...

IPC-J-STD-001G: ข้อกำหนดสำหรับการบัดกรีอิเล็กทรอนิกส์และงานประกอบอิเล็กทรอนิกส์

IPC-J-STD-001G: Requisiti per la Brasatura degli Assemblaggi Elettrici ed Elettronici

IPC-A-610G: Accettabilità degli Assemblaggi Elettronici

IPC-A-610G: การยอมรับของงานประกอบอิเล็กทรอนิกส์

IPC-A-610G: Godkendelseskrav for elektronikprodukter

IPC-J-STD-001G: Krav til loddede elektriske og elektroniske produkter

IPC-6012D-AM1: Qualification and Performance Specification for Rigid Printed Boards

IPC-9505: Guideline Methodology for Assessing Component and Cleaning Materials Compatibility

IPC-J-STD-003C-WAM1&2-English: Solderability Tests for Printed Boards

IPC-2226A: Sectional Design Standard for High Density Interconnect (HDI) Printed Boards

IPC-6013D:Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-7091: Design and Assembly Process Implementation of 3D Components

IPC-7530A: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

IPC-1072-AM1: Intellectual Property Protection in Electronic Assembly Manufacturing

IPC-1755 WAM1-2: IPC-1755 WAM1&2 Conflict Minerals Data Exchange Standard

IPC-1401: Supply Chain Social Responsibility Management System Guidance

IPC-4101E: Specification for Base Materials for Rigid and Multilayer Printed Boards

IPC-9204: Guideline on Flexibility and Stretchability Testing for Printed Electronics

IPC-A-610FC: Telecom Addendum to IPC-A-610 Revision F Acceptability of Electronic Assemblies