IPC-4204A WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...
IPC-2291: Design Guideline for Printed Electronics
IPC-7095C: Design and Assembly Process Implementation for BGAs
IPC-HDBK-830A: Guidelines for Design, Selection, and Application of Conformal Coatings
IPC-2222A: Sectional Design Standard for Rigid Organic Printed Boards