J-STD-006C-AM1: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...
36 Products
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IPC-6012D-AM1: Qualification and Performance Specification for Rigid Printed Boards
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IPC-7711/21C: Rework, modificatie en repair van elektronische assemblages - Chapter 1
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IPC/WHMA-A-620C: 케이블 및 와이어 하네스 어셈블리들에 대한 요건들 및 수용
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IPC-J-STD-001G: 솔더링된 전기 및 전자 어셈블리들에 대한 요건들
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IPC-7711/21C: 전자 어셈블리들의 리웤, 변경 및 수리
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IPC-A-610G: 전자 어셈블리들의 허용 가능성
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IPC-A610G: Acceptatie van geassembleerde printplaten
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IPC-J-STD-001G: Eisen voor gesoldeerde elektrische en elektronische geassembleerde printplaten
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IPC-7711/21C: Reprise, Modification et Réparation des Assemblages Électroniques
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IPC-A-610G: Acceptabilité des Assemblages Électroniques
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IPC-A-620C-NL: Eisen en acceptatie van kabel en draadboom assemblage
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IPC-J-STD-001GS: Annexe des produits électroniques des applications spatiales et militaires à la norme J-STD-001G, Exigences...
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IPC-4103B: Specification for Base Materials for High Speed/High Frequency Applications
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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English
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IPC-9505: Guideline Methodology for Assessing Component and Cleaning Materials Compatibility
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IPC-J-STD-003C-WAM1: Solderability Tests for Printed Boards
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IPC-7091: Design and Assembly Process Implementation of 3D Components
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IPC-2226A: Sectional Design Standard for High Density Interconnect (HDI) Printed Boards
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IPC-6013D:Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
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IPC-A-610G: Acceptability of Electronic Assemblies
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J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies
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J-STD-005A: Requirements for Soldering Pastes
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IPC-1755 WAM1-2: IPC-1755 WAM1&2 Conflict Minerals Data Exchange Standard