45 Products

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IPC-4591A: 印刷电子功能导电材料要求

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IPC-J-STD-002E: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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IPC-4103B: Specification for Base Materials for High Speed/High Frequency Applications

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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English

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IPC-J-STD-001G: 솔더링된 전기 및 전자 어셈블리들에 대한 요건들

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IPC-A-610G: Acceptability of Electronic Assemblies

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J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies

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J-STD-006C-AM1: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...

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IPC-A-610G: 전자 어셈블리들의 허용 가능성

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IPC-A610G: Acceptatie van geassembleerde printplaten

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IPC-J-STD-001G: Eisen voor gesoldeerde elektrische en elektronische geassembleerde printplaten

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IPC-A-610G: Acceptabilité des Assemblages Électroniques

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IPC-J-STD-001GS: Annexe des produits électroniques des applications spatiales et militaires à la norme J-STD-001G, Exigences...

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IPC-J-STD-001G: Les exigences relatives au brasage d’assemblages électroniques et électriques

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IPC-J-STD-001G: 焊接的电⽓和电⼦组件要求 - Chinese

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IPC-A-610G: 电⼦组件的可接受性 -Chinese

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IPC-6012D-AM1: Qualification and Performance Specification for Rigid Printed Boards

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IPC-6013D: 挠性和刚挠印制板的鉴定及性能规范

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IPC-9505: Guideline Methodology for Assessing Component and Cleaning Materials Compatibility

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IPC-J-STD-003C-WAM1&2-English: Solderability Tests for Printed Boards

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IPC-2226A: Sectional Design Standard for High Density Interconnect (HDI) Printed Boards

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IPC-6013D:Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

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IPC-A-640: 光纤,光缆和混合线束组件的验收要求

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IPC-7091: Design and Assembly Process Implementation of 3D Components