IPC-4591A: 印刷电子功能导电材料要求

IPC-J-STD-002E: 元器件引线、焊端、焊片、端子和导线的可焊性测试

IPC-4103B: Specification for Base Materials for High Speed/High Frequency Applications

EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English

IPC-J-STD-001G: 솔더링된 전기 및 전자 어셈블리들에 대한 요건들

IPC-A-610G: Acceptability of Electronic Assemblies

J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies

J-STD-006C-AM1: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...

IPC-A-610G: 전자 어셈블리들의 허용 가능성

IPC-A-610G: Acceptabilité des Assemblages Électroniques

IPC-J-STD-001GS: Annexe des produits électroniques des applications spatiales et militaires à la norme J-STD-001G, Exigences...

IPC-J-STD-001G: Les exigences relatives au brasage d’assemblages électroniques et électriques

IPC-J-STD-001G: 焊接的电⽓和电⼦组件要求 - Chinese

IPC-A-610G: 电⼦组件的可接受性 -Chinese

IPC-6012D-AM1: Qualification and Performance Specification for Rigid Printed Boards

IPC-6013D: 挠性和刚挠印制板的鉴定及性能规范

IPC-9505: Guideline Methodology for Assessing Component and Cleaning Materials Compatibility

IPC-J-STD-003C-WAM1&2-English: Solderability Tests for Printed Boards

IPC-2226A: Sectional Design Standard for High Density Interconnect (HDI) Printed Boards

IPC-6013D:Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-A-640: 光纤，光缆和混合线束组件的验收要求

IPC-7091: Design and Assembly Process Implementation of 3D Components

IPC-A-620B-S-CN: IPC/WHMA-A-620B航天应用电子部件补充标准

IPC-7530A: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes