J-STD-003C WAM1: Solderability Tests for Printed Boards
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J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...
IPC-7095C: Design and Assembly Process Implementation for BGAs
IPC-2221B: Generic Standard on Printed Board Design
IPC-AJ-820A: Assembly & Joining Handbook
J-STD-005A: Requirements for Soldering Pastes
IPC-2222A: Sectional Design Standard for Rigid Organic Printed Boards