J-STD-003C WAM1: Solderability Tests for Printed Boards
4 Products
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J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...
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IPC-J-STD-006C: 電子グレードはんだ合金、および電子はんだ付用やに入り/やになし固体はんだに関する要求事項
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IPC-7095C: Design and Assembly Process Implementation for BGAs